Saturday, 25 June 2016

CALL FOR PAPERS: Symposium on "Intelligence for Embedded and Cyber-physical Systems" (IntECS 2016) at IEEE Symposium Series in Computational Intelligence 2016

6 – 9 December 2016, Athens, Greece (

Paper submission:  July 18, 2016
Author notifications: September 12, 2016 
Camera-ready submission: October 10, 2016
Early registration: October 10, 2016
Conference Dates: December 6 - 9, 2016

*Aims and Scope*
In recent years, there has been an increasing interest in designing embedded and cyber-physical systems featuring intelligent skills. Beside addressing the specific tasks they have been designed for, these systems are expected, for example, to autonomously make decisions/activate reactions, perform self-diagnosis, and learn from and interact with the operating environment.

This symposium addresses novel and emerging computational-intelligence and machine-learning solutions to provide such an intelligent behavior to embedded and cyberphisical systems. IntECS aspires at providing a forum for researchers who are actively working on intelligent embedded and cyberphisical systems and, more in general, on computational intelligent solutions for real world applications.

The symposium will be held within the IEEE 2016 Symposium Series in Computational Intelligence (6 – 9 December 2016, Athens, Greece)

. Intelligence for embedded systems
. Intelligence for cyber-physical systems
. Cognitive fault-diagnosis systems
. Smart objects and Internet of Things
. Intelligent sensor networks
. Intelligent sensors and robotics
. Intelligent measurement systems
. Adaptive solutions to operate in evolving/changing environments
. Intelligent systems for real-world applications
. Computational intelligence techniques for smart buildings and critical-infrastructure monitoring

Embedded systems, cyber-physical systems, fault-diagnosis systems, intelligent applications, intelligent sensors, intelligent sensor networks, Computational Intelligence,  Internet of Things.

*Symposium Organizers*
- Cesare Alippi (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy)
- Giacomo Boracchi (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy)
- Manuel Roveri (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy)

*Technical Program Committee*
Rami Abielmona, Larus Technologies, Canada
Maurizio Bocca, Bosch Research and Technology Center, CA, USA
Guilherme DeSouza, University of Missouri-Columbia, MO, USA
Michalis Michaelidis, Cyprus University of Technology, Cyprus
Stavros Ntalampiras, Politecnico di Milano, Italy
Mimmo Parente, Università di Salerno, Italy
Vicenç Puig, Universitat Politècnica de Catalunya, Spain
Yew-Soon Ong, Nanyang Technological University, Singapore
Stefano Squartini, Università Politecnica delle Marche, Italy
Dongbin Zhao, University of Chinese Academy of Science, China

*Paper Submission Procedure*
Submissions must contain original, high quality, not submitted or elsewhere published work. Authors must submit their paper through the IEEE SSCI 2016 webpage

Accepted papers will be included in the IEEE SSCI 2016 proceedings and indexed through IEEExplore.
Further information and Paper submission can be found at the IEEE SSCI 2016 webpage

For any question or inquiry, please, don't hesitate to contact me at

The call for papers as well as more detailed information can be retrieved from IntECS 2016 webpage
and from the main SSCI 2016 webpage

Please make sure you select:
"Intelligence for Cyber-physical and Embedded Systems" (IntECS 2016) during the submission process


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